Electroplating
YURAY delivers high-precision electroplating services for advanced packaging and interconnect applications. From copper pillar plating and bump formation to RDL and pad metallization, our plating platform ensures uniform deposition, precise dimensional control, and reliable metallurgical quality — supporting TSV, micro-bump, flip-chip, and 2.5D/3D integration.
OVERVIEW
YURAY provides comprehensive electroplating solutions covering copper pillar plating, solder bump formation, RDL metallization, and pad plating. From seed-layer deposition and photoresist patterning to precision electroplating, photoresist stripping, and CMP planarization, our full-flow plating platform supports 4- to 12-inch wafers with tight uniformity control, high aspect-ratio filling capability, and reliable metallurgical performance for advanced packaging, flip-chip, TSV, and 2.5D/3D integration applications.
SERVICES
Our electroplating platform enables high-precision metallization for advanced packaging and interconnect structures — from fine-pitch copper pillars and solder bumps to redistribution layers and under-bump metallurgy.
Cu Pillar Plating
High-precision copper pillar electroplating with uniform height and diameter control across the wafer. Optimized for fine-pitch flip-chip, TSV reveal, and advanced packaging interconnects with excellent coplanarity and reliable metallurgical quality.
| Parameter | Specification |
|---|---|
| Wafer Size | 4 / 6 / 8 / 12 inch |
| Aspect Ratio | Up to 10:1 |
| CD Uniformity | < 3% (within wafer) |
| Thickness Uniformity | < 5% (within wafer) |
| Pillar Diameter | 10 μm – 100 μm |
| Pillar Height | 5 μm – 100 μm |
| Material | Cu / Cu + SnAg cap |
CASE STUDY
At YURAY, we provide end-to-end full-chain services. Below is a detailed look at how we translate stringent customer Statement of Work (SOW) requirements into delivered, proven plating results.
RDL Copper Plating on Glass Interposer
Fine-Pitch Cu Pillar Plating on 8-inch Wafer
METROLOGY & QUALITY ASSURANCE
Reliable Deposition Quality, Complimentary Characterization Included At YURAY, deposition service means more than simply depositing a film. We combine qualified equipment, controlled processes, experienced engineering support, and rigorous quality management to deliver stable, repeatable thin-film performance. Every project can be supported with a free comprehensive characterization report, providing customers with transparent and actionable quality data. Depending on the service requirements, reports may include film thickness, uniformity, surface condition, adhesion, composition, and other relevant characterization results. Choose YURAY for high-quality film deposition, responsive technical support, and verified results—without additional reporting costs
Quantified SOW Requirements
YURAY converts SOW requirements into measurable criteria, defining clear quality targets and inspection standards.
Continuous Process Improvement
YURAY identifies root causes of issues, such as interface peeling, and implements effective corrective solutions.
SOW-Aligned Characterization Reports
YURAY delivers characterization reports with indicators directly aligned to SOW requirements for transparent verification.
Third-Party Double Confirmation
YURAY uses independent third-party laboratories to double-confirm critical indicators through characterization and inspection.
APPLICATIONS
High-density interconnects for advanced chip packaging.
Vertical silicon interconnects for heterogeneous integration.
Glass-based vertical interconnects for advanced packaging.
Precision metal deposition for semiconductor interconnects.
Reliable wafer/glass bonding for 3D integration.
Thin-film deposition for advanced semiconductor manufacturing.
Need a Custom Wafer or Fabrication Process?
Share your drawings, wafer specifications, or project requirements — our engineering team will prepare a technical proposal and quote within one business day.