Focused Ion Beam (FIB)
FIB enables precise cross-section prep, sample milling, nano-machining, and circuit edit on wafers for nanoscale failure analysis.
Application Scenarios: Cross-section prep, sample milling, circuit edit.
Classic Standard: ASTM E1508 / SEMI G86.
Charging Standard: 5,000 RMB per hour.
OVERVIEW
YURAY provides focused ion beam (FIB) services for site-specific cross-section preparation, precision ion milling, and TEM lamella fabrication. Our FIB platform combines high-resolution ion imaging with nanoscale milling to enable precise defect localization and structural analysis of TSVs, bonding interfaces, bumps, and multi-layer stacks. We support both FIB-SEM dual-beam cross-sectioning and lift-out TEM lamella preparation with integrated EDX analysis for comprehensive failure analysis and process verification.
SERVICES
Our FIB platform enables precise, site-specific nanoscale milling and sample preparation — supporting failure analysis, interface study, and TEM-ready lamella fabrication for a wide range of device structures.
FIB Milling & Cross-Section Analysis
Site-specific ion milling and cross-section preparation for precise defect localization and structural analysis — enabling nanoscale inspection of TSVs, bumps, and multi-layer interfaces without mechanical damage.
| Parameter | Specification |
|---|---|
| Imaging Resolution | < 5 nm |
| Ion Source | Ga+ liquid metal |
| Cross-Section Size | Up to 100 × 50 μm |
| Milling Precision | ≤ 10 nm |
| Structures | TSV, bump, RDL, interface |
| Elemental Analysis | EDX / EDS |
| Wafer Size | 4 / 6 / 8 / 12 inch |
TEM Lamella Preparation
Precision lift-out TEM lamella fabrication using FIB for atomic-resolution structural analysis — enabling preparation of electron-transparent specimens from specific device sites for TEM and STEM investigation.
| Parameter | Specification |
|---|---|
| Lamella Thickness | < 100 nm (final) |
| Preparation Method | In-situ lift-out |
| Lamella Size | Up to 15 × 10 μm |
| Final Thinning | Low-kV polishing |
| Target Sites | Interfaces, defects, TSV |
| Compatibility | TEM / STEM / EDS |
| Output | Mounted TEM lamella |
CASE STUDY
At YURAY, we provide end-to-end full-chain metrology services. Below is a detailed look at how we translate stringent customer Statement of Work (SOW) requirements into delivered, proven FIB characterization results.
TSV Cross-Section FIB Analysis
- FIB site-specific milling and polishing
- Sample Supply — 12-inch TSV wafer (Cu-filled), incoming inspection and die selection
- High-resolution FIB/SEM imaging
- Cross-section dimensional measurement
- Analysis — Fill-quality inspection in Cu
- Analysis — EDX line-scan and mapping
- 12-inch wafer supported
- Target TSV cross-sectioned
- TSV profile clearly resolved
- CD: 10.1 μm, liner: 120 nm
- Voids detected & measured
- Cu/barrier/liner confirmed
- Images, measurements, and EDX data consolidated
- Final characterization report delivered
TEM Lamella for Bonding Interface Study
- FIB in-situ lift-out at target site
- Sample Supply — Hybrid-bonded wafer pair (Cu-Cu), incoming inspection and sample preparation
- Low-kV final thinning
- FIB/SEM pre-check imaging
- Analysis — Damage-layer minimization
- Metrology — Grid mounting and documentation
- Bonded pair supported
- Interface lamella fabricated
- Lamella thickness: < 80 nm
- Cu-Cu interface located
- Amorphous layer < 3 nm
- TEM-ready lamella delivered
- Images, thickness data, and records consolidated
- Final report delivered
METROLOGY & QUALITY ASSURANCE
Reliable Deposition Quality, Complimentary Characterization Included At YURAY, deposition service means more than simply depositing a film. We combine qualified equipment, controlled processes, experienced engineering support, and rigorous quality management to deliver stable, repeatable thin-film performance. Every project can be supported with a free comprehensive characterization report, providing customers with transparent and actionable quality data. Depending on the service requirements, reports may include film thickness, uniformity, surface condition, adhesion, composition, and other relevant characterization results. Choose YURAY for high-quality film deposition, responsive technical support, and verified results—without additional reporting costs
Quantified SOW Requirements
YURAY converts SOW requirements into measurable criteria, defining clear quality targets and inspection standards.
Continuous Process Improvement
YURAY identifies root causes of issues, such as interface peeling, and implements effective corrective solutions.
SOW-Aligned Characterization Reports
YURAY delivers characterization reports with indicators directly aligned to SOW requirements for transparent verification.
Third-Party Double Confirmation
YURAY uses independent third-party laboratories to double-confirm critical indicators through characterization and inspection.
APPLICATIONS
High-density interconnects for advanced chip packaging.
Vertical silicon interconnects for heterogeneous integration.
Glass-based vertical interconnects for advanced packaging.
Precision metal deposition for semiconductor interconnects.
Reliable wafer/glass bonding for 3D integration.
Thin-film deposition for advanced semiconductor manufacturing.
Need a Custom Wafer or Fabrication Process?
Share your drawings, wafer specifications, or project requirements — our engineering team will prepare a technical proposal and quote within one business day.