Fab Solutions
Integrated front-end and back-end process services — from deposition and lithography to etching, plating, bonding, and dicing.
OVERVIEW
YURAY TECH provides end-to-end wafer fab process services covering thin-film deposition, photolithography, etching, electroplating, wafer bonding, thinning, and dicing. Working from a single qualified flow, our engineers tune each step to your material stack and device requirements — reducing handoffs between suppliers, lowering handling and contamination risk, and shortening the path from design to working silicon.
SERVICES
Film Deposition
PVD, CVD, ALD and oxide thin film deposition services for wafers & glass substrates, offering controllable thickness and excellent layer uniformity.
Photolithography
Mask making, photoresist coating, exposure & development for micro pattern fabrication, supporting MEMS and microfluidic device patterning.
Etching
Wet etching, dry etching and deep reactive ion etching for silicon, glass and quartz, achieving high aspect ratio and precise feature definition.
Electroplating
Copper, gold, nickel and chromium electroplating on wafer substrates, for metal structural layers and conductive circuitry of MEMS devices.
Wafer Thining
Wafer backside grinding, polishing and stress relief, providing ultra-thin wafers with low bow and high surface quality.
Bonding
Wafer direct bonding, anodic bonding and adhesive bonding for silicon-glass stacking, suitable for MEMS packaging and microfluidic chips.
Dicing
Wafer & glass substrate dicing, laser scribing and die separation, delivering clean cutting edges for microchips and MEMS dies.
APPLICATIONS
High-density interconnects for advanced chip packaging.
Vertical silicon interconnects for heterogeneous integration.
Glass-based vertical interconnects for advanced packaging.
Precision metal deposition for semiconductor interconnects.
Reliable wafer/glass bonding for 3D integration.
Thin-film deposition for advanced semiconductor manufacturing.
Need a Custom Wafer or Fabrication Process?
Share your drawings, wafer specifications, or project requirements — our engineering team will prepare a technical proposal and quote within one business day.