Precision Probe Testing / Precision Probe Measurement
Precision probe station testing performs detailed electrical characterization of micro patterns and MEMS wafers for device performance and defect evaluation.
Application Scenarios: Wafer probing, electrical characterization, micro-pattern defect analysis.
Classic Standard: SEMI G86 / IEC 60749.
Charging Standard: Quoted per sample quantity and test duration. Please contact YURAY for pricing.
OVERVIEW
YURAY provides precision probe measurement using high-accuracy probe stations and micro-positioning systems. We measure micro-bump height and coplanarity, fine-pitch RDL dimensions, via profiles, and contact resistance across wafers, panels, and packages. Controlled contact force and calibrated positioning ensure repeatable, low-damage probing, while multi-point mapping delivers within-die and within-wafer statistics with full reporting.
SERVICES
Our precision probe platform enables accurate dimensional and electrical characterization of fine-pitch interconnects — supporting bump metrology, continuity verification, and contact-resistance measurement across a wide range of structures.
Micro-Bump Probe Measurement
High-precision probe-based dimensional measurement of micro-bumps and solder balls, including height, diameter, coplanarity, and pitch across full wafers and packages — enabling tight process control for fine-pitch flip-chip interconnects.
| Parameter | Specification |
|---|---|
| Positioning Accuracy | ± 0.1 μm |
| Bump Size | 5 – 200 μm |
| Coplanarity | ≤ 1 μm |
| Pitch Measurement | ≥ 10 μm pitch |
| Contact Force | 1 – 200 g |
| Wafer Size | 4 / 6 / 8 / 12 inch |
| Output | Height map + statistics |
Contact & Continuity Probing
Precision probing of RDL, via, and pad structures for continuity and contact-resistance verification — enabling detection of opens, shorts, and high-resistance interfaces across fine-pitch interconnect networks.
| Parameter | Specification |
|---|---|
| Probe Type | Micro-positioning probe station |
| Feature Size | ≥ 1 μm pad / line |
| Resistance Range | μΩ – MΩ |
| Contact Force | 1 – 100 g |
| Measurement | Continuity, resistance |
| Sample Types | Wafers, panels, packages |
| Output | Measurement map + data |
CASE STUDY
At YURAY, we provide end-to-end reliability testing services. Below is a detailed look at how we translate stringent customer Statement of Work (SOW) requirements into delivered, proven probe-measurement results.
Fine-Pitch Micro-Bump Coplanarity Measurement
- Multi-point probing
- Sample Supply — Incoming inspection and die selection
- Test Setup — Tip and force calibration
- Analysis — Statistical mapping
- Pitch — Multi-point pitch measurement
- Evaluation — Rating and documentation
- 12-inch wafer supported
- Calibration verified
- Height data captured
- Coplanarity: 0.6 μm measured
- Pitch confirmed within tolerance
- PASS — within acceptance criteria
- Height maps and data integrated
- Final characterization report delivered
RDL Continuity & Contact Verification
- Multi-point probing
- Sample Supply — Incoming inspection and sample preparation
- Test Setup — Kelvin-ready probing
- Resistance — 4-wire measurement
- Analysis — Automated mapping
- Evaluation — Rating and documentation
- RDL panel supported
- Setup verified
- Continuity confirmed
- Resistance within tolerance
- No opens detected
- PASS — within acceptance criteria
- Data and maps integrated
- Final characterization report delivered
METROLOGY & QUALITY ASSURANCE
Reliable Deposition Quality, Complimentary Characterization Included At YURAY, deposition service means more than simply depositing a film. We combine qualified equipment, controlled processes, experienced engineering support, and rigorous quality management to deliver stable, repeatable thin-film performance. Every project can be supported with a free comprehensive characterization report, providing customers with transparent and actionable quality data. Depending on the service requirements, reports may include film thickness, uniformity, surface condition, adhesion, composition, and other relevant characterization results. Choose YURAY for high-quality film deposition, responsive technical support, and verified results—without additional reporting costs
Quantified SOW Requirements
YURAY converts SOW requirements into measurable criteria, defining clear quality targets and inspection standards.
Continuous Process Improvement
YURAY identifies root causes of issues, such as interface peeling, and implements effective corrective solutions.
SOW-Aligned Characterization Reports
YURAY delivers characterization reports with indicators directly aligned to SOW requirements for transparent verification.
Third-Party Double Confirmation
YURAY uses independent third-party laboratories to double-confirm critical indicators through characterization and inspection.
APPLICATIONS
High-density interconnects for advanced chip packaging.
Vertical silicon interconnects for heterogeneous integration.
Glass-based vertical interconnects for advanced packaging.
Precision metal deposition for semiconductor interconnects.
Reliable wafer/glass bonding for 3D integration.
Thin-film deposition for advanced semiconductor manufacturing.
Need a Custom Wafer or Fabrication Process?
Share your drawings, wafer specifications, or project requirements — our engineering team will prepare a technical proposal and quote within one business day.