Bonding
YURAY delivers advanced wafer bonding capabilities including hybrid bonding and anodic bonding for 3D IC integration, heterogeneous packaging, and MEMS applications. With sub-micron alignment precision and high bonding uniformity, our platform enables high-density vertical interconnects and reliable wafer-level assembly.
OVERVIEW
YURAY provides comprehensive wafer bonding solutions covering hybrid bonding and anodic bonding for advanced 3D integration, MEMS, and optoelectronic applications. From wafer surface preparation and plasma activation to precision alignment and bonding process optimization, our platform delivers sub-micron alignment accuracy, high bonding yield, and excellent uniformity across 4- to 12-inch wafers. We support wafer-to-wafer and die-to-wafer integration flows with integrated metrology and end-to-end process management.
SERVICES
Our wafer bonding platform enables high-density vertical interconnects and reliable wafer-level assembly — from fine-pitch hybrid bonding for 3D IC stacking to anodic bonding for MEMS and glass-silicon integration.
Hybrid Bonding
Direct copper hybrid bonding for ultra-high-density vertical interconnects, combining dielectric bonding and copper-to-copper metallurgical bonding in a single process. Ideal for 3D IC stacking, chiplet integration, and high-bandwidth applications.
| Parameter | Specification |
|---|---|
| Pitch Size | Down to sub-1 μm |
| Alignment Accuracy | < 500 nm |
| Bonding Uniformity | 99.9% wafer coverage |
| Wafer Size | 6 / 8 / 12 inch |
| Bond Interface | Dielectric + Cu-Cu hybrid |
| Process Temp | 150 – 400 °C |
| Application | 3D IC, chiplet, HBM |
CASE STUDY
At YURAY, we provide end-to-end full-chain services. Below is a detailed look at how we translate stringent customer Statement of Work (SOW) requirements into delivered, proven bonding results.
Glass-Silicon Anodic Bonding for MEMS Packaging
Fine-Pitch Hybrid Bonding for 3D IC Stacking
METROLOGY & QUALITY ASSURANCE
Reliable Deposition Quality, Complimentary Characterization Included At YURAY, deposition service means more than simply depositing a film. We combine qualified equipment, controlled processes, experienced engineering support, and rigorous quality management to deliver stable, repeatable thin-film performance. Every project can be supported with a free comprehensive characterization report, providing customers with transparent and actionable quality data. Depending on the service requirements, reports may include film thickness, uniformity, surface condition, adhesion, composition, and other relevant characterization results. Choose YURAY for high-quality film deposition, responsive technical support, and verified results—without additional reporting costs
Quantified SOW Requirements
YURAY converts SOW requirements into measurable criteria, defining clear quality targets and inspection standards.
Continuous Process Improvement
YURAY identifies root causes of issues, such as interface peeling, and implements effective corrective solutions.
SOW-Aligned Characterization Reports
YURAY delivers characterization reports with indicators directly aligned to SOW requirements for transparent verification.
Third-Party Double Confirmation
YURAY uses independent third-party laboratories to double-confirm critical indicators through characterization and inspection.
APPLICATIONS
High-density interconnects for advanced chip packaging.
Vertical silicon interconnects for heterogeneous integration.
Glass-based vertical interconnects for advanced packaging.
Precision metal deposition for semiconductor interconnects.
Reliable wafer/glass bonding for 3D integration.
Thin-film deposition for advanced semiconductor manufacturing.
Need a Custom Wafer or Fabrication Process?
Share your drawings, wafer specifications, or project requirements — our engineering team will prepare a technical proposal and quote within one business day.