Scanning Electron Microscope (SEM)
SEM delivers high-resolution surface imaging, microstructure observation, and dimension measurement for wafers and thin films at micro and nano scale.
Application Scenarios: Microstructure imaging, surface analysis, dimension test.
Classic Standard: ASTM E986 / ISO 22309.
Charging Standard: 1,500 RMB per sample (Note: This bundled price includes both the cross-section slicing preparation and the SEM observation)..
OVERVIEW
YURAY provides comprehensive scanning electron microscopy (SEM) services for high-resolution surface imaging and cross-section analysis of semiconductor wafers, packages, and advanced packaging structures. From top-view surface inspection and critical-dimension measurement to cross-section analysis with dicing-based sample preparation, our SEM platform delivers sub-2 nm imaging resolution and excellent depth of field. We support defect inspection, bump and RDL measurement, and structural verification with integrated EDX elemental analysis.
SERVICES
Our SEM platform enables high-resolution surface and cross-section imaging — supporting defect analysis, critical-dimension measurement, and structural verification across a wide range of materials and device structures.
High-Resolution Surface Imaging
High-resolution top-view SEM imaging for surface morphology, critical-dimension measurement, and defect inspection — enabling precise characterization of patterned features, bumps, RDL lines, and surface anomalies at nanometer scale.
| Parameter | Specification |
|---|---|
| Resolution | < 2 nm |
| Magnification | 10× – 1,000,000× |
| Acceleration Voltage | 0.5 – 30 kV |
| Detectors | SE / BSE / In-lens |
| Measurement | CD, pitch, feature size |
| Sample Types | Si, glass, thin films, metals |
| Wafer Size | 4 / 6 / 8 / 12 inch |
Cross-Section & Failure Analysis
Cross-section SEM analysis with dicing-based sample preparation for layer thickness measurement, interface inspection, and failure analysis — enabling precise structural verification of TSVs, bonding interfaces, and multi-layer stacks.
| Parameter | Specification |
|---|---|
| Sample Prep | With dicing / cleaving |
| Resolution | < 2 nm |
| Layer Measurement | ≥ 5 nm thickness |
| Analysis Types | Interface, void, delamination |
| Elemental Analysis | EDX / EDS |
| Structures | TSV, bump, bonding interface |
| Output | Images + measurement data |
CASE STUDY
At YURAY, we provide end-to-end full-chain metrology services. Below is a detailed look at how we translate stringent customer Statement of Work (SOW) requirements into delivered, proven SEM characterization results.
Bump & Solder Joint Cross-Section Analysis
- SEM imaging at optimized kV
- Sample Supply — 8-inch Cu pillar wafer (3 units), incoming inspection and die selection
- Dicing and precision polishing
- Cross-section dimensional measurement
- Analysis — IMC layer and void inspection
- Analysis — EDX analysis of bump interface
- 3 samples received & logged
- Cross-sections prepared
- Bump interface clearly resolved
- Height: 50.2 μm, CD: 25.1 μm
- IMC thickness: ~1.5 μm measured
- Cu/Sn composition confirmed
- SEM images, measurements, and EDX data consolidated
- Final characterization report delivered
TSV & Bonding Interface Inspection
- High-resolution SEM imaging
- Sample Supply — 12-inch TSV wafer (Cu-filled), incoming inspection and sample preparation
- Dicing and precision polishing
- Cross-section dimensional measurement
- Analysis — SEM void inspection in Cu fill
- Analysis — Interface inspection of bonded pair
- 12-inch wafer supported
- TSV cross-sections prepared
- TSV profile clearly resolved
- Top: 10.2 μm / Bottom: 8.9 μm
- Small voids detected & measured
- Void-free bonding interface confirmed
- SEM images, measurements, and analysis integrated
- Final characterization report delivered
METROLOGY & QUALITY ASSURANCE
Reliable Deposition Quality, Complimentary Characterization Included At YURAY, deposition service means more than simply depositing a film. We combine qualified equipment, controlled processes, experienced engineering support, and rigorous quality management to deliver stable, repeatable thin-film performance. Every project can be supported with a free comprehensive characterization report, providing customers with transparent and actionable quality data. Depending on the service requirements, reports may include film thickness, uniformity, surface condition, adhesion, composition, and other relevant characterization results. Choose YURAY for high-quality film deposition, responsive technical support, and verified results—without additional reporting costs
Quantified SOW Requirements
YURAY converts SOW requirements into measurable criteria, defining clear quality targets and inspection standards.
Continuous Process Improvement
YURAY identifies root causes of issues, such as interface peeling, and implements effective corrective solutions.
SOW-Aligned Characterization Reports
YURAY delivers characterization reports with indicators directly aligned to SOW requirements for transparent verification.
Third-Party Double Confirmation
YURAY uses independent third-party laboratories to double-confirm critical indicators through characterization and inspection.
APPLICATIONS
High-density interconnects for advanced chip packaging.
Vertical silicon interconnects for heterogeneous integration.
Glass-based vertical interconnects for advanced packaging.
Precision metal deposition for semiconductor interconnects.
Reliable wafer/glass bonding for 3D integration.
Thin-film deposition for advanced semiconductor manufacturing.
Need a Custom Wafer or Fabrication Process?
Share your drawings, wafer specifications, or project requirements — our engineering team will prepare a technical proposal and quote within one business day.