Computed Tomography (CT)
X-ray CT provides 3D internal scanning, void/crack detection, and microstructure analysis for MEMS and micro devices.
Application Scenarios: 3D scanning, internal defect inspection, structure analysis.
Classic Standard: ASTM E1695 / ISO 15708.
Charging Standard: 2,500 RMB per hour.
OVERVIEW
YURAY provides X-ray computed tomography (CT) services for non-destructive 3D internal characterization of semiconductor packages, MEMS devices, solder interconnects, and advanced packaging structures. Our high-resolution CT system captures hundreds of projection images at multiple angles and reconstructs detailed 3D volumetric data — enabling precise defect localization, dimensional measurement, and internal structural analysis in all three axes without sample destruction. We support failure analysis, process development, and quality verification for complex 3D integrated devices.
SERVICES
Our CT inspection platform enables comprehensive 3D internal analysis — from micron-level defect detection to full-volume dimensional metrology — supporting failure analysis, process optimization, and reliability assessment.
Package 3D Defect Analysis
Three-dimensional CT imaging for comprehensive internal defect detection in semiconductor packages — including voids, cracks, delamination, and solder joint defects — with precise 3D localization and volumetric quantification.
| Parameter | Specification |
|---|---|
| 3D Resolution | ≤ 5 μm (voxel size) |
| Void Detection | ≥ 5 μm void size |
| Defect Types | Voids, cracks, delamination |
| Package Types | BGA, QFN, SiP, SoC, PoP |
| Voltage Range | 20 – 160 kV |
| Sample Size | Up to 100 mm |
| Analysis Output | 3D volume render + cross-sections |
3D Interconnect Metrology
CT-based dimensional metrology for 3D interconnect structures including TSVs, copper pillars, micro-bumps, and RDL — enabling non-destructive measurement of critical dimensions in all three spatial axes.
| Parameter | Specification |
|---|---|
| CD Measurement | ≥ 10 μm feature size |
| Structure Types | TSV, Cu pillar, micro-bump, RDL |
| Dimensional Accuracy | ± 2 μm (typical) |
| Measurement Planes | XY, XZ, YZ + arbitrary |
| Voltage Range | 30 – 130 kV |
| Sample Size | Up to 50 mm (high-res) |
| Output | 3D model + dimensional data |
CASE STUDY
At YURAY, we provide end-to-end full-chain metrology services. Below is a detailed look at how we translate stringent customer Statement of Work (SOW) requirements into delivered, proven CT inspection results.
SiP Package Internal Defect CT Analysis
- 360° rotation CT with optimized kV
- Sample Supply — SiP package samples (3 units), incoming inspection and sample registration
- High-resolution reconstruction at 5 μm voxel
- Analysis — 3D defect localization and measurement
- Analysis — Arbitrary plane slicing and measurement
- Metrology — Volume rendering and defect annotation
- 3 samples received & logged
- Full-volume 3D data acquired
- Voids ≥ 8 μm detected
- 3D defect coordinates + volume data
- Multi-plane cross-sections delivered
- 3D renderings and images included
- 3D data, images, and analysis consolidated
- Final CT analysis report delivered
TSV 3D Dimensional CT Metrology
- Sub-micron voxel CT scanning
- Sample Supply — TSV die sample (Cu-filled, 20×100 μm), incoming inspection and sample mounting
- XY cross-section measurement at multiple Z
- XZ / YZ cross-section analysis
- Analysis — Volumetric defect analysis in Cu fill
- Analysis — Multi-TSV measurement and statistics
- Die sample supported
- 3D volume data at 2 μm voxel
- Top: 20.5 μm / Bottom: 18.2 μm
- Depth: 98.5 μm, Taper: ~1.3°
- 3 small voids detected (3–5 μm)
- 10 TSVs measured, stats reported
- CT images, dimensional data, and analysis integrated
- Final CT metrology report delivered
METROLOGY & QUALITY ASSURANCE
Reliable Deposition Quality, Complimentary Characterization Included At YURAY, deposition service means more than simply depositing a film. We combine qualified equipment, controlled processes, experienced engineering support, and rigorous quality management to deliver stable, repeatable thin-film performance. Every project can be supported with a free comprehensive characterization report, providing customers with transparent and actionable quality data. Depending on the service requirements, reports may include film thickness, uniformity, surface condition, adhesion, composition, and other relevant characterization results. Choose YURAY for high-quality film deposition, responsive technical support, and verified results—without additional reporting costs
Quantified SOW Requirements
YURAY converts SOW requirements into measurable criteria, defining clear quality targets and inspection standards.
Continuous Process Improvement
YURAY identifies root causes of issues, such as interface peeling, and implements effective corrective solutions.
SOW-Aligned Characterization Reports
YURAY delivers characterization reports with indicators directly aligned to SOW requirements for transparent verification.
Third-Party Double Confirmation
YURAY uses independent third-party laboratories to double-confirm critical indicators through characterization and inspection.
APPLICATIONS
High-density interconnects for advanced chip packaging.
Vertical silicon interconnects for heterogeneous integration.
Glass-based vertical interconnects for advanced packaging.
Precision metal deposition for semiconductor interconnects.
Reliable wafer/glass bonding for 3D integration.
Thin-film deposition for advanced semiconductor manufacturing.
Need a Custom Wafer or Fabrication Process?
Share your drawings, wafer specifications, or project requirements — our engineering team will prepare a technical proposal and quote within one business day.