Peel Testing / Peel Strength Testing
Peel strength testing measures film-to-substrate adhesion, verifying bonding quality and layer durability for microelectronic and MEMS components.
Application Scenarios: Adhesion testing, film bonding verification, layer separation analysis.
Classic Standard: ASTM D903 / ASTM D3359.
Charging Standard: 3,000 RMB per peel test (includes Cu plating and tape stretching). Cross-cut (百格) testing is free and included in process packages.
OVERVIEW
YURAY provides peel testing for RDL copper, plated metallization, polyimide and dielectric films, and laminated structures. Using controlled-angle peel fixtures and calibrated load cells, we measure peel strength and characterize adhesion failure modes such as cohesive, adhesive, and delamination failures. Testing is performed per IPC-TM-650 and ASTM D3359 standards, with force–displacement curves, adhesion ratings, and imaging delivered in the final report.
SERVICES
Our peel-test platform enables accurate, repeatable adhesion measurement across metal, dielectric, and coating systems — supporting both fixed-angle peel testing and cross-cut tape adhesion evaluation.
90° Peel Testing
90° peel testing for RDL copper, foil, and plated film adhesion per IPC-TM-650 Method 2.4.9 — delivering quantitative peel-strength data for metallization adhesion control.
| Parameter | Specification |
|---|---|
| Test Standard | IPC-TM-650 Method 2.4.9 |
| Peel Angle | 90° |
| Peel Strength | 0.1 – 50 N/mm |
| Peel Speed | 1 – 500 mm/min |
| Sample Types | RDL Cu, foil, plated films |
| Load Resolution | 0.001 N |
| Output | Force–displacement curve |
180° Peel & Tape Adhesion Testing
180° peel and cross-cut tape adhesion testing per ASTM D3359 and IPC-TM-650 for film and coating adhesion verification — enabling adhesion rating and delamination detection on dielectric and passivation layers.
| Parameter | Specification |
|---|---|
| Test Standard | ASTM D3359 / IPC-TM-650 |
| Peel Angle | 180° |
| Adhesion Rating | 0B – 5B (cross-cut) |
| Peel Strength | 0.1 – 20 N/mm |
| Peel Speed | 1 – 300 mm/min |
| Sample Types | PI, dielectric, coatings |
| Output | Rating + force data |
CASE STUDY
At YURAY, we provide end-to-end reliability testing services. Below is a detailed look at how we translate stringent customer Statement of Work (SOW) requirements into delivered, proven peel-testing results.
RDL Copper Peel Adhesion Qualification
- Automated peel sequence
- Sample Supply — Incoming inspection and sample preparation
- Test Setup — Fixture and load calibration
- Measurement — Force data capture
- Analysis — Microscope inspection
- Evaluation — Statistical summary
- RDL panel supported
- Setup verified
- All lines tested
- Mean: 1.1 N/mm measured
- Cohesive failure dominant
- PASS — within acceptance criteria
- Curves and images integrated
- Final characterization report delivered
PI / Dielectric Film Peel Strength Program
- Automated peel sequence
- Sample Supply — Incoming inspection and sample preparation
- Test Setup — Grid scribe and tape application
- Measurement — Rating per ASTM D3359
- Analysis — Microscope inspection
- Evaluation — Rating and documentation
- Coated wafer supported
- Setup verified
- All strips tested
- Rating: 5B achieved
- No delamination observed
- PASS — within acceptance criteria
- Images and data integrated
- Final characterization report delivered
METROLOGY & QUALITY ASSURANCE
Reliable Deposition Quality, Complimentary Characterization Included At YURAY, deposition service means more than simply depositing a film. We combine qualified equipment, controlled processes, experienced engineering support, and rigorous quality management to deliver stable, repeatable thin-film performance. Every project can be supported with a free comprehensive characterization report, providing customers with transparent and actionable quality data. Depending on the service requirements, reports may include film thickness, uniformity, surface condition, adhesion, composition, and other relevant characterization results. Choose YURAY for high-quality film deposition, responsive technical support, and verified results—without additional reporting costs
Quantified SOW Requirements
YURAY converts SOW requirements into measurable criteria, defining clear quality targets and inspection standards.
Continuous Process Improvement
YURAY identifies root causes of issues, such as interface peeling, and implements effective corrective solutions.
SOW-Aligned Characterization Reports
YURAY delivers characterization reports with indicators directly aligned to SOW requirements for transparent verification.
Third-Party Double Confirmation
YURAY uses independent third-party laboratories to double-confirm critical indicators through characterization and inspection.
APPLICATIONS
High-density interconnects for advanced chip packaging.
Vertical silicon interconnects for heterogeneous integration.
Glass-based vertical interconnects for advanced packaging.
Precision metal deposition for semiconductor interconnects.
Reliable wafer/glass bonding for 3D integration.
Thin-film deposition for advanced semiconductor manufacturing.
Need a Custom Wafer or Fabrication Process?
Share your drawings, wafer specifications, or project requirements — our engineering team will prepare a technical proposal and quote within one business day.