Warpage Measurement
Non-contact warpage and bow measurement evaluates wafer flatness across 4–12 inch wafers for process control and quality verification.
Application Scenarios: Warpage test, bow measurement, wafer flatness evaluation.
Classic Standard: SEMI G86 / ASTM F534.
Charging Standard: 1,000 RMB per instance/test.
OVERVIEW
YURAY provides warpage measurement services for full-field, non-contact topography and deformation analysis of wafers, substrates, and packages. Using shadow moiré and phase-shift techniques, our platform characterizes bow, warpage, and twist with micron-level accuracy across the entire surface. We support room-temperature and thermal (reflow-simulation) warpage measurement — enabling process monitoring, package reliability assessment, and advanced packaging development.
SERVICES
Our warpage measurement platform enables full-field non-contact topography analysis — supporting wafer-level and package-level deformation characterization with thermal capability for reflow and reliability assessment.
Wafer & Substrate Warpage Mapping
Full-field non-contact warpage measurement of wafers and substrates — characterizing bow, warpage, and twist across the entire surface with micron-level accuracy for process monitoring and quality control.
| Parameter | Specification |
|---|---|
| Warpage Range | 0.1 – 500 μm |
| Measurement Accuracy | ± 0.5 μm |
| Measurement Method | Shadow moiré / phase-shift |
| Measured Parameters | Bow, warpage, twist |
| Wafer Size | 4 / 6 / 8 / 12 inch |
| Output | 3D map + contour data |
| Measurement Speed | ≤ 60 sec per wafer |
Package Warpage & Thermal Deformation
Temperature-dependent warpage measurement for packages and substrates — enabling reflow-simulation analysis, thermal-deformation characterization, and reliability assessment of advanced packaging structures.
| Parameter | Specification |
|---|---|
| Temperature Range | RT – 260 °C |
| Warpage Range | 0.1 – 500 μm |
| Measurement Accuracy | ± 1 μm |
| Package Types | BGA, QFN, SiP, PoP, substrate |
| Analysis | Warpage vs. temperature curve |
| Output | 3D maps + temperature curves |
| Sample Size | Up to 300 mm |
CASE STUDY
At YURAY, we provide end-to-end full-chain metrology services. Below is a detailed look at how we translate stringent customer Statement of Work (SOW) requirements into delivered, proven warpage characterization results.
Post-Bond Wafer Warpage Characterization
- Full-field shadow-moiré warpage mapping
- Sample Supply — 12-inch bonded wafer pair (3 units), incoming inspection and wafer registration
- 3D topography analysis
- Full-surface non-contact scanning
- Analysis — Radial warpage distribution analysis
- Metrology — 3x repeat measurement
- 3 wafers received & logged
- Average warpage: 32 μm
- Bow: 28 μm, Twist: 9 μm
- 100% surface mapped
- Center-edge profile delivered
- Repeatability: ± 0.3 μm
- 3D maps, contour data, and analysis consolidated
- Final characterization report delivered
Package Warpage vs. Temperature Analysis
- Thermal warpage measurement across reflow profile
- Sample Supply — BGA package samples (5 units), incoming inspection and sample registration
- High-temperature shadow-moiré mapping
- Analysis — Curve generation and inflection analysis
- Analysis — Statistical comparison of 5 samples
- Metrology — Full-field 3D maps at key temperatures
- 5 samples received & logged
- Full temperature curve acquired
- Peak warpage: 78 μm @ 217 °C
- Warpage curve delivered
- Sample-to-sample comparison delivered
- 3D maps at RT / peak / cool-down
- Maps, curves, and analysis integrated
- Final characterization report delivered
METROLOGY & QUALITY ASSURANCE
Reliable Deposition Quality, Complimentary Characterization Included At YURAY, deposition service means more than simply depositing a film. We combine qualified equipment, controlled processes, experienced engineering support, and rigorous quality management to deliver stable, repeatable thin-film performance. Every project can be supported with a free comprehensive characterization report, providing customers with transparent and actionable quality data. Depending on the service requirements, reports may include film thickness, uniformity, surface condition, adhesion, composition, and other relevant characterization results. Choose YURAY for high-quality film deposition, responsive technical support, and verified results—without additional reporting costs
Quantified SOW Requirements
YURAY converts SOW requirements into measurable criteria, defining clear quality targets and inspection standards.
Continuous Process Improvement
YURAY identifies root causes of issues, such as interface peeling, and implements effective corrective solutions.
SOW-Aligned Characterization Reports
YURAY delivers characterization reports with indicators directly aligned to SOW requirements for transparent verification.
Third-Party Double Confirmation
YURAY uses independent third-party laboratories to double-confirm critical indicators through characterization and inspection.
APPLICATIONS
High-density interconnects for advanced chip packaging.
Vertical silicon interconnects for heterogeneous integration.
Glass-based vertical interconnects for advanced packaging.
Precision metal deposition for semiconductor interconnects.
Reliable wafer/glass bonding for 3D integration.
Thin-film deposition for advanced semiconductor manufacturing.
Need a Custom Wafer or Fabrication Process?
Share your drawings, wafer specifications, or project requirements — our engineering team will prepare a technical proposal and quote within one business day.