Salt Spray Testing / Salt Fog Testing
Salt fog corrosion testing evaluates anti-corrosion performance of metal coatings on wafers under harsh salt-laden atmospheric conditions.
Application Scenarios: Environmental reliability testing, coating quality verification, anti-corrosion performance assessment.
Classic Standard: ASTM B117 / ISO 9227.
Charging Standard: Quoted per sample quantity and test duration. Please contact YURAY for pricing.
OVERVIEW
Salt fog corrosion testing evaluates anti-corrosion performance of metal coatings on wafers under harsh salt-laden atmospheric conditions.
SERVICES
Our salt spray platform enables controlled, repeatable corrosion testing across a wide range of finishes and structures — supporting neutral, acidified, and cyclic exposure for reliability qualification and material screening.
Neutral Salt Spray (NSS) Testing
Continuous neutral salt fog exposure per ASTM B117 / ISO 9227 for evaluating the corrosion resistance of plated and metallized surfaces — enabling direct comparison of finishes and verification of long-term environmental durability.
| Parameter | Specification |
|---|---|
| Test Standard | ASTM B117 / ISO 9227 NSS |
| Salt Solution | 5% ± 1% NaCl |
| Chamber Temperature | 35 °C ± 2 °C |
| Exposure Duration | 24 – 1,000 h |
| Sample Types | Plated wafers, bumps, connectors |
| Evaluation | White rust, red rust, pitting |
| Output | Images + corrosion rating |
Cyclic & Acetic Acid Salt Spray
Accelerated cyclic corrosion and acetic acid salt spray (AASS / CASS) testing per ASTM G85 and ISO 9227 for harsher environments and faster time-to-failure — reproducing realistic wet/dry service conditions on packaging and panel metallization.
| Parameter | Specification |
|---|---|
| Test Standard | ASTM G85 / ISO 9227 AASS |
| Test Method | Wet / dry cyclic exposure |
| Solution | Acetic acid + NaCl (CASS) |
| Chamber Temperature | 35 – 50 °C |
| Cycles | 4 – 96 cycles |
| Sample Types | Packages, TGV panels |
| Evaluation | Corrosion rate & morphology |
CASE STUDY
At YURAY, we provide end-to-end reliability testing services. Below is a detailed look at how we translate stringent customer Statement of Work (SOW) requirements into delivered, proven corrosion-testing results.
Cu Pillar Bump Corrosion Qualification
- Programmed exposure and monitoring
- Sample Supply — Incoming inspection and die selection
- Test Setup — Chamber setup and calibration
- Inspection — High-resolution corrosion inspection
- Analysis — Optical imaging of bump surfaces
- Evaluation — Rating and documentation
- 8-inch wafer supported
- 5% NaCl, 35 °C verified
- 96 h exposure completed
- No red rust observed
- Minor edge oxidation documented
- PASS — within acceptance criteria
- Images, ratings, and data consolidated
- Final characterization report delivered
TGV Panel Metallization Salt-Fog Validation
- Programmed exposure and monitoring
- Sample Supply — Incoming inspection and sample preparation
- Test Setup — Chamber setup per ISO 9227
- Inspection — Corrosion and blistering inspection
- Measurement — Image-based quantification
- Evaluation — Rating and documentation
- TGV panel supported
- Acidified solution verified
- 48 h exposure completed
- No delamination observed
- Corrosion area < 1%
- PASS — within acceptance criteria
- Images and analysis integrated
- Final characterization report delivered
METROLOGY & QUALITY ASSURANCE
Reliable Deposition Quality, Complimentary Characterization Included At YURAY, deposition service means more than simply depositing a film. We combine qualified equipment, controlled processes, experienced engineering support, and rigorous quality management to deliver stable, repeatable thin-film performance. Every project can be supported with a free comprehensive characterization report, providing customers with transparent and actionable quality data. Depending on the service requirements, reports may include film thickness, uniformity, surface condition, adhesion, composition, and other relevant characterization results. Choose YURAY for high-quality film deposition, responsive technical support, and verified results—without additional reporting costs
Quantified SOW Requirements
YURAY converts SOW requirements into measurable criteria, defining clear quality targets and inspection standards.
Continuous Process Improvement
YURAY identifies root causes of issues, such as interface peeling, and implements effective corrective solutions.
SOW-Aligned Characterization Reports
YURAY delivers characterization reports with indicators directly aligned to SOW requirements for transparent verification.
Third-Party Double Confirmation
YURAY uses independent third-party laboratories to double-confirm critical indicators through characterization and inspection.
APPLICATIONS
High-density interconnects for advanced chip packaging.
Vertical silicon interconnects for heterogeneous integration.
Glass-based vertical interconnects for advanced packaging.
Precision metal deposition for semiconductor interconnects.
Reliable wafer/glass bonding for 3D integration.
Thin-film deposition for advanced semiconductor manufacturing.
Need a Custom Wafer or Fabrication Process?
Share your drawings, wafer specifications, or project requirements — our engineering team will prepare a technical proposal and quote within one business day.