Metrology
High-accuracy dimensional, film, and defect characterization — AFM, SEM, X-Ray, CT, and ellipsometry — verifying every process step.
OVERVIEW
Metrology is one of the most critical links in the process chain, providing essential verification from process development to quality control and failure analysis. At YURAY, we believe that reliable characterization is not just measurement—it is the foundation for understanding process results, identifying variations, and supporting confident engineering decisions.
For selected process packages, YURAY provides complimentary supporting metrology and corresponding reports to verify the agreed scope of work (SOW) and key process outcomes. This integrated approach helps customers evaluate film quality, surface morphology, structural integrity, dimensional consistency, defects, and other critical parameters efficiently.
In addition, YURAY offers standalone external metrology services for customers requiring independent analysis. Our service goes beyond raw data or unprocessed images.
We deliver professional reports, clear and clean characterization images, detailed annotations, quantitative measurements or calculations where applicable, and expert interpretation of observed features.
By translating measurement results into actionable engineering conclusions, YURAY helps customers understand what the data means, assess potential process issues, and determine practical next steps. Our commitment is to provide accurate, transparent, and technically meaningful characterization support for every project.
SERVICES
Atomic Force Microscope (AFM)
AFM delivers nanoscale 3D surface topography and roughness analysis for wafer and thin-film quality control in semiconductor and MEMS manufacturing.Classic Standard: ASTM E2859 / ISO 4287.
X-Ray
X-ray inspection delivers non-destructive internal imaging of voids, defects, and thickness for semiconductor samples, supporting quality control and failure analysis.Classic Standard: ASTM E505 / IPC-A-610.
Computed Tomography (CT)
X-ray CT provides 3D internal scanning, void/crack detection, and microstructure analysis for MEMS and micro devices.Classic Standard: ASTM E1695 / ISO 15708.
Ellipsometer
Spectroscopic ellipsometry measures thin-film thickness and optical constants on silicon and glass wafers, non-contact, for process monitoring and QA.Classic Standard: ASTM E1893 / SEMI MF534.
Scanning Electron Microscope (SEM)
SEM delivers high-resolution surface imaging, microstructure observation, and dimension measurement for wafers and thin films at micro and nano scale.Classic Standard: ASTM E986 / ISO 22309.
Transmission Electron Microscope (TEM)
TEM delivers atomic-scale imaging and cross-section analysis of thin films and microstructures for advanced materials research and process optimization.Classic Standard: ASTM E2809 / ISO 29301.
Focused Ion Beam (FIB)
FIB enables precise cross-section prep, sample milling, nano-machining, and circuit edit on wafers for nanoscale failure analysis.Classic Standard: ASTM E1508 / SEMI G86.
Laser Scanning Confocal Microscope (LSCM)
LSCM provides 3D surface profiling, height measurement, and micro-roughness analysis of patterned wafers, non-contact, for defect inspection.Classic Standard: ISO 25178 / ASTM E1840.
Warpage Measurement
Non-contact warpage and bow measurement evaluates wafer flatness across 4–12 inch wafers for process control and quality verification.Classic Standard: SEMI G86 / ASTM F534.
Automated Optical Inspection (AOI)
AOI performs high-speed pattern defect detection, particle inspection, and dimensional measurement on microfabricated substrates for non-contact quality control.Classic Standard: IPC-A-610 / SEMI G86.
APPLICATIONS
High-density interconnects for advanced chip packaging.
Vertical silicon interconnects for heterogeneous integration.
Glass-based vertical interconnects for advanced packaging.
Precision metal deposition for semiconductor interconnects.
Reliable wafer/glass bonding for 3D integration.
Thin-film deposition for advanced semiconductor manufacturing.
Need a Custom Wafer or Fabrication Process?
Share your drawings, wafer specifications, or project requirements — our engineering team will prepare a technical proposal and quote within one business day.