Tensile Testing / Pull Testing
Tensile and pull testing measures bonding strength of thin films on wafers, quantifying force to break bonds under mechanical stress.
Application Scenarios: Bond strength testing, mechanical robustness evaluation, thin-film interface testing.
Classic Standard: ASTM D882 / ASTM F88.
Charging Standard: 300 RMB per test.
OVERVIEW
Tensile and pull testing measures bonding strength of thin films on wafers, quantifying force to break bonds under mechanical stress.
SERVICES
Our pull-test platform enables accurate, repeatable mechanical-strength measurement across wire, bump, and interconnect structures — supporting both destructive qualification and non-destructive process monitoring.
Wire Bond Pull Testing
Destructive and non-destructive wire pull testing per MIL-STD-883 Method 2011 and JEDEC JESD22-B116 — measuring bond strength and classifying fracture modes for Au, Cu, and Al wire interconnects.
| Parameter | Specification |
|---|---|
| Test Standard | MIL-STD-883 Method 2011 |
| Bond Types | Au / Cu / Al wire |
| Load Range | 0.5 – 100 N |
| Load Resolution | 0.01 N |
| Test Speed | 0.1 – 10 mm/s |
| Test Mode | Destructive / non-destructive |
| Output | Pull force + fracture mode |
Bump & Solder Ball Pull Testing
Cold and hot bump pull (CBP / HBP) testing for Cu pillar and solder bump interconnects per JEDEC JESD22-B117 — enabling high-load bond-strength measurement and interface-quality verification for flip-chip structures.
| Parameter | Specification |
|---|---|
| Test Standard | JEDEC JESD22-B117 |
| Bump Types | Cu pillar, solder ball, micro-bump |
| Load Range | 0.5 – 500 N |
| Test Speed | 0.1 – 50 mm/s |
| Temperature | RT – 250 °C |
| Failure Analysis | Fracture mode classification |
| Output | Force–displacement curve |
CASE STUDY
At YURAY, we provide end-to-end reliability testing services. Below is a detailed look at how we translate stringent customer Statement of Work (SOW) requirements into delivered, proven pull-testing results.
Au Wire Bond Pull Strength Qualification
- Automated pull sequence
- Sample Supply — Incoming inspection and logging
- Test Setup — Calibration and hook setup
- Measurement — Force data capture
- Analysis — Microscope fracture inspection
- Evaluation — Statistical summary
- 30 samples received
- Load cell calibrated
- All bonds tested
- Mean: 9.4 gf measured
- Neck break dominant (acceptable)
- PASS — within acceptance criteria
- Data, curves, and images integrated
- Final characterization report delivered
Cu Pillar Bump Pull Reliability Program
- Automated pull sequence
- Sample Supply — Incoming inspection and die selection
- Test Setup — Stage heating and calibration
- Measurement — Force data capture
- Analysis — Fracture mode classification
- Evaluation — Statistical summary
- 12-inch wafer supported
- Temperature verified
- All bumps tested
- Mean: 17.8 gf measured
- IMC fracture < 10%
- PASS — within acceptance criteria
- Data and images consolidated
- Final characterization report delivered
METROLOGY & QUALITY ASSURANCE
Reliable Deposition Quality, Complimentary Characterization Included At YURAY, deposition service means more than simply depositing a film. We combine qualified equipment, controlled processes, experienced engineering support, and rigorous quality management to deliver stable, repeatable thin-film performance. Every project can be supported with a free comprehensive characterization report, providing customers with transparent and actionable quality data. Depending on the service requirements, reports may include film thickness, uniformity, surface condition, adhesion, composition, and other relevant characterization results. Choose YURAY for high-quality film deposition, responsive technical support, and verified results—without additional reporting costs
Quantified SOW Requirements
YURAY converts SOW requirements into measurable criteria, defining clear quality targets and inspection standards.
Continuous Process Improvement
YURAY identifies root causes of issues, such as interface peeling, and implements effective corrective solutions.
SOW-Aligned Characterization Reports
YURAY delivers characterization reports with indicators directly aligned to SOW requirements for transparent verification.
Third-Party Double Confirmation
YURAY uses independent third-party laboratories to double-confirm critical indicators through characterization and inspection.
APPLICATIONS
High-density interconnects for advanced chip packaging.
Vertical silicon interconnects for heterogeneous integration.
Glass-based vertical interconnects for advanced packaging.
Precision metal deposition for semiconductor interconnects.
Reliable wafer/glass bonding for 3D integration.
Thin-film deposition for advanced semiconductor manufacturing.
Need a Custom Wafer or Fabrication Process?
Share your drawings, wafer specifications, or project requirements — our engineering team will prepare a technical proposal and quote within one business day.