Wafer Thining
YURAY provides precision wafer thinning services combining back-grinding and chemical mechanical polishing to achieve ultra-thin wafers with tight thickness control, low surface roughness, and excellent uniformity — supporting 3D IC stacking, TSV reveal, and advanced packaging applications.
OVERVIEW
YURAY provides comprehensive wafer thinning solutions combining mechanical back-grinding and chemical mechanical polishing (CMP). From coarse material removal to ultra-smooth surface finishing, our thinning platform delivers precise thickness control, excellent uniformity, and minimal subsurface damage across silicon, glass, and compound semiconductor wafers. We support 3D IC stacking, TSV reveal, ultra-thin die packaging, and MEMS applications with integrated metrology and end-to-end process flow management.
SERVICES
Our wafer thinning platform combines high-throughput back-grinding with precision CMP finishing — enabling ultra-thin wafer manufacturing with tight thickness control and damage-free surfaces for advanced packaging and 3D integration.
Back-Grinding
Precision mechanical back-grinding for bulk wafer thickness reduction, utilizing multi-step grinding (coarse / medium / fine) with tight thickness uniformity and controlled subsurface damage — ideal for TSV reveal, 3D stacking, and ultra-thin die applications.
| Parameter | Specification |
|---|---|
| Final Thickness | Down to 50 μm |
| Thickness Uniformity | < 2% (within wafer) |
| Surface Roughness | < 200 nm (post-grind) |
| Wafer Size | 4 / 6 / 8 / 12 inch |
| Grinding Steps | Coarse → Medium → Fine |
| Subsurface Damage | Controlled < 5 μm |
| Edge Handling | Edge trim & chamfer option |
CASE STUDY
At YURAY, we provide end-to-end full-chain services. Below is a detailed look at how we translate stringent customer Statement of Work (SOW) requirements into delivered, proven thinning results.
TSV Reveal CMP on 12-inch Wafer
Ultra-Thin Wafer Thinning for 3D Stacking
METROLOGY & QUALITY ASSURANCE
Reliable Deposition Quality, Complimentary Characterization Included At YURAY, deposition service means more than simply depositing a film. We combine qualified equipment, controlled processes, experienced engineering support, and rigorous quality management to deliver stable, repeatable thin-film performance. Every project can be supported with a free comprehensive characterization report, providing customers with transparent and actionable quality data. Depending on the service requirements, reports may include film thickness, uniformity, surface condition, adhesion, composition, and other relevant characterization results. Choose YURAY for high-quality film deposition, responsive technical support, and verified results—without additional reporting costs
Quantified SOW Requirements
YURAY converts SOW requirements into measurable criteria, defining clear quality targets and inspection standards.
Continuous Process Improvement
YURAY identifies root causes of issues, such as interface peeling, and implements effective corrective solutions.
SOW-Aligned Characterization Reports
YURAY delivers characterization reports with indicators directly aligned to SOW requirements for transparent verification.
Third-Party Double Confirmation
YURAY uses independent third-party laboratories to double-confirm critical indicators through characterization and inspection.
APPLICATIONS
High-density interconnects for advanced chip packaging.
Vertical silicon interconnects for heterogeneous integration.
Glass-based vertical interconnects for advanced packaging.
Precision metal deposition for semiconductor interconnects.
Reliable wafer/glass bonding for 3D integration.
Thin-film deposition for advanced semiconductor manufacturing.
Need a Custom Wafer or Fabrication Process?
Share your drawings, wafer specifications, or project requirements — our engineering team will prepare a technical proposal and quote within one business day.