Ellipsometer
Spectroscopic ellipsometry measures thin-film thickness and optical constants on silicon and glass wafers, non-contact, for process monitoring and QA.
Application Scenarios: Film thickness measurement, refractive index testing, optical metrology.
Classic Standard: ASTM E1893 / SEMI MF534.
Charging Standard: 600 RMB per point.
OVERVIEW
YURAY provides spectroscopic ellipsometry services for non-destructive thin-film characterization including thickness measurement, refractive index (n), extinction coefficient (k), and optical dispersion analysis. Our spectroscopic ellipsometer covers deep-UV to near-infrared wavelengths, enabling precise characterization of dielectric films, metal layers, semiconductors, and optical coatings on silicon, glass, and compound semiconductor substrates. We support single-point measurement and full-wafer mapping for process uniformity monitoring and quality assurance.
SERVICES
Our ellipsometry platform enables accurate thin-film metrology — from ultra-thin ALD layers to thick dielectric films — with comprehensive optical constant characterization and mapping capabilities for process development and production monitoring.
Thin-Film Thickness & Optical Constants
Precise measurement of thin-film thickness and optical constants (n, k) using spectroscopic ellipsometry — supporting single-layer and multi-layer film stacks with advanced modeling for dielectric, metal, and semiconductor materials.
| Parameter | Specification |
|---|---|
| Thickness Range | 0.1 nm – 50 μm |
| Thickness Precision | ≤ 0.1 nm |
| Wavelength Range | 190 – 1700 nm |
| Refractive Index (n) | 1.0 – 5.0 range |
| Extinction Coef. (k) | 0 – 5.0 range |
| Film Types | Dielectric, metal, semiconductor |
| Sample Size | 4 / 6 / 8 / 12 inch |
Wafer Mapping & Uniformity
Full-wafer ellipsometric mapping for thickness and optical constant uniformity analysis — enabling process monitoring, center-to-edge variation assessment, and film-quality verification across the entire substrate.
| Parameter | Specification |
|---|---|
| Wafer Size | 4 / 6 / 8 / 12 inch |
| Mapping Points | Up to 121 points |
| Spot Size | ≥ 50 μm |
| Uniformity Output | WIWNU, range, σ |
| Mapping Modes | Thickness / n / k mapping |
| Measurement Speed | ≤ 5 sec per point |
| Contour Maps | 2D color contour plots |
CASE STUDY
At YURAY, we provide end-to-end full-chain metrology services. Below is a detailed look at how we translate stringent customer Statement of Work (SOW) requirements into delivered, proven ellipsometry characterization results.
ALD AlOₓ Film Thickness & Optical Constant Characterization
- Spectroscopic ellipsometry (190–1700 nm)
- Sample Supply — 12-inch glass with ALD AlOₓ coating, incoming inspection and sample identification
- Cauchy / Tauc-Lorentz model fitting
- UV absorption analysis
- 49-point full-wafer mapping
- Analysis — Full-wavelength dispersion analysis
- 12-inch glass supported
- Thickness: 19.8 nm (center)
- n = 2.32 @ 270 nm
- k < 0.001 @ 270 nm
- Uniformity: 1.4% (within wafer)
- Dispersion curves (190–1700 nm) delivered
- Spectra, data, and maps consolidated
- Final ellipsometry report delivered
Multi-Layer Dielectric Stack Ellipsometry
- Multi-layer model (Si substrate + SiO₂ + SiN)
- Sample Supply — 8-inch Si wafer with SiN/SiO₂ stack, incoming inspection and sample preparation
- Multi-layer regression analysis
- Dispersion model for SiN film
- 25-point across-wafer mapping
- Analysis — MSE (mean squared error) analysis
- 8-inch Si wafer supported
- SiN: 45.2 nm
- SiO₂: 100.8 nm
- n = 2.05 @ 633 nm
- SiN uniformity: 1.2%
- MSE < 5 (excellent fit)
- Model, spectra, thickness data, and maps integrated
- Final ellipsometry report delivered
METROLOGY & QUALITY ASSURANCE
Reliable Deposition Quality, Complimentary Characterization Included At YURAY, deposition service means more than simply depositing a film. We combine qualified equipment, controlled processes, experienced engineering support, and rigorous quality management to deliver stable, repeatable thin-film performance. Every project can be supported with a free comprehensive characterization report, providing customers with transparent and actionable quality data. Depending on the service requirements, reports may include film thickness, uniformity, surface condition, adhesion, composition, and other relevant characterization results. Choose YURAY for high-quality film deposition, responsive technical support, and verified results—without additional reporting costs
Quantified SOW Requirements
YURAY converts SOW requirements into measurable criteria, defining clear quality targets and inspection standards.
Continuous Process Improvement
YURAY identifies root causes of issues, such as interface peeling, and implements effective corrective solutions.
SOW-Aligned Characterization Reports
YURAY delivers characterization reports with indicators directly aligned to SOW requirements for transparent verification.
Third-Party Double Confirmation
YURAY uses independent third-party laboratories to double-confirm critical indicators through characterization and inspection.
APPLICATIONS
High-density interconnects for advanced chip packaging.
Vertical silicon interconnects for heterogeneous integration.
Glass-based vertical interconnects for advanced packaging.
Precision metal deposition for semiconductor interconnects.
Reliable wafer/glass bonding for 3D integration.
Thin-film deposition for advanced semiconductor manufacturing.
Need a Custom Wafer or Fabrication Process?
Share your drawings, wafer specifications, or project requirements — our engineering team will prepare a technical proposal and quote within one business day.